Newsgroup sci.engr.mech 26452

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Subject: Re: Young's Modulus vs. Temperature -- From: Vicen=?iso-8859-1?Q?=E7 Marqu=E8?=s
Subject: Pipe Flow Software -- From: "David C. Price"
Subject: Re: engineering schools -- From: ""
Subject: Re: Which engineers are more in demand? -- From: pjtemes@ix.netcom.com(Peter Temesvary )
Subject: Re: Young's Modulus vs. Temperature -- From: "Chris Rogers"
Subject: Re: MAKE MONEY NOW -- From: "Tomislav Vazdar"
Subject: Re: aluminum on steel linear bearings? -- From: peattier@aol.com (PEATTIE R)
Subject: Re: Tecplot, etc. -- From: ssingh1@xws379.sc.intel.com (Surinder Singh)
Subject: STEAM-LIST, A Mailing List About Industrial Steam -- From: miles@mail.utexas.edu (Miles Abernathy)
Subject: Re: FEA - inexpensive software packages? -- From: Jeff Wright
Subject: Re: Pipe Flow Software -- From: Greg Jackson
Subject: Re: Assistance needed with o-ring problem -- From: tsiporak@actcom.co.il (Israel Kehaty)
Subject: Re: Pipe Flow Software -- From: DPAS@msn.com (DENNIS ADAMS)
Subject: Re: Young's Modulus vs. Temperature -- From: Jim Papadopoulos
Subject: Re: ANNOUNCE: Video Camera On a Chip to be produced in USA -- From: sam@stdavids.picker.com (Sam Goldwasser)
Subject: Re: Need heat transfer material -- From: Mark Thornton
Subject: Re: Cost indexes -- From: Robert Davis
Subject: boiler feed pumps - ph & oxygen levels on material selection -- From: andrew@gilkes.u-net.com (Andrew Wood)
Subject: Re: Tecplot, etc. -- From: Polyhedron Software
Subject: Re: Human Powered Vehicles - looking for a news group -- From: Doug Milliken
Subject: Baby's skull - modelling mechanical properties -- From: Paul Kurowski
Subject: Re: Young's Modulus vs. Temperature -- From: arosen@freenet.columbus.oh.us (Alan Rosenfield)
Subject: Re: PE Liability -- From: Eric Mieczkowski
Subject: Re: Tungsten-Rhenium Alloys - data wanted -- From: Thomas.P.Herbell@lerc.nasa.gov (Thomas P Herbell)
Subject: Re: high pressure coolant retrofit -- From: klwasson@aol.com (Klwasson)
Subject: Re: Which engineers are more in demand? -- From: rizzo@hogpb.ho.att.com (-A.RIZZO)
Subject: Re: engineering schools -- From: Cedric Savineau
Subject: Re: Pipe Flow Software -- From: cbeer@netcom.com (Cindy Beer)
Subject: Looking for UK Job Shops -- From: "John F. Smith"
Subject: Re: Properties of polyurethane sought -- From: rongraham1@aol.com (RonGraham1)
Subject: post doc in engineering -- From: hines@drea.dnd.ca (Paul Hines)
Subject: sterling engine??? -- From: gekeays@acs5.acs.ucalgary.ca (Gloria Edith Keays)
Subject: REQ.: high pressure pipes - methods to study the effects of a break -- From: rollet@worldnet.fr (Patrick Rollet)
Subject: Theoretical Mechanics: Curriculum Discussions (Re-post) -- From: seaotter6@aol.com (Sea otter6)
Subject: Re: Young's Modulus vs. Temperature -- From: rjh2@pl264d.cc.Lehigh.EDU (RONALD J. HARTRANFT)
Subject: Re: PE Liability -- From: VENABLE@cemr.wvu.edu (Wallace Venable)
Subject: Re: ANNOUNCE: Video Camera On a Chip to be produced in USA -- From: guz2@fm550g.cc.lehigh.edu (GUANGHUA ZHANG)
Subject: A simple question about bending dies -- From: felice@pioneer.net (Felice Luftschein & Nicholas Carter)
Subject: Re: FEA: Modelling Bolt Holes -- From: osman@stargate.cinternet.net (osman buyukisik)
Subject: Re: Baby's skull - modelling mechanical properties -- From: rizzo@hogpb.ho.att.com (-A.RIZZO)

Articles

Subject: Re: Young's Modulus vs. Temperature
From: Vicen=?iso-8859-1?Q?=E7 Marqu=E8?=s
Date: Thu, 19 Sep 1996 19:59:23 -0700
Robert Paynter wrote:
> =
> Does anyone know relationships between Young's Modulus and Temperature
> for typical "Engineering Materials", eg Steel, G.R.P.  I'm sure the
> general effect is: "As temperature increases stiffness reduces" but
> can anyone quantify it. I'm not looking for extremes, of stress
> or temperature.
> =
> Any leads will be appreciated
> =
> Robert Paynter
> =
> Dept. Aeronautics,                         ....          ...  \_/
> Imperial College,                   /     ( (. )      -.(   ).(_)--
>                                    /      (...).)     (   (.. ).\
> c/o Energy Research Unit      ----O=3D<                 (......)..)\
> Rutherford Lab, Chilton           |\                        /  |  \
> DIDCOT, Oxon OX11 0QX            -| \    -,-,-,-,              |
> United Kingdom                 ,-,|    -,-,-,-,   Tel:+44 (0)1235 445304
> email: R.Paynter@rl.ac.uk    -,-,-|,-,-,-,-,      Fax:+44 (0)1235 446863
Indeed. As T increases, E decreases, but this is just a thumb rule, valid =
for most materials. The particular behaviour of each alloy is a function =
of a number of parameters and needs to be determined experimentally. =
I suggest to take a look at the "Atlas of Stress-Strain curves" published =
by ASM. =
Good luck!
-- =
Vicen=E7 Marqu=E8s - Laboratori General d'Assaigs i Investigacions - LGAI

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Subject: Pipe Flow Software
From: "David C. Price"
Date: Thu, 19 Sep 1996 11:21:43 -0400
I am looking for a software package to calculate pressure drops
and flow in multi-loop pipe circuits.
Any pointer for commercial or shareware packages would be appreciated.
Thanks
David Price
dcprice@dsmea.com
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Subject: Re: engineering schools
From: ""
Date: Thu, 19 Sep 1996 16:18:26 -0400
 In everyone's travels has anyone ever heard of SUNY at Binghamton???
It's no RPI but i'm just curious.
						Chris
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Subject: Re: Which engineers are more in demand?
From: pjtemes@ix.netcom.com(Peter Temesvary )
Date: 19 Sep 1996 20:27:58 GMT
>
>>Somebody asked:
>> Of mechanical, electrical, and aerospace, which engineer is more in
>> demand?  And which would you do if you were interested in all 3?  
>>(or all 8 for that matter) Thank-you kindly.
>
>snip
>
>Today, I would advise any engineering student to strive to do much 
>more than simply learn engineering.  The tunnel-vision perspective 
>is a dangerous one, because it prevents one from seeing the complete
>corporate system of which we, engineers, are mere components.
>The engineers that are in greatest demand are the ones who can
>see what their companies need and can adapt to provide it.  For
>these, there are always jobs.
:
:The above cannot be stated enough I think.
:
To that end, I would suggest to the student (I presume) that asked the
question: look into undergrad programs which are "general" engineering
(commonly called "Engineering and Applied Science," e.g., at Caltech &
Stanford).  You will take a variety of engineering classes covering
everyting from circuits to fluid dynamics, and you can usually tailor
your focus somewhat in your last 1 to 1-1/2 years.  There are two huge
advantages to such a course of study: (1) you don't tie yourself into a
certain field before you know if it really interests you or not, and
(2) you have a relatively broad technical background.  I did such a
degree at Harvey Mudd College here in L.A.; as a freshman I was
convinced I wanted to go into aerospace, but at the beginning of my
senior year I realized that wasn't for me and "switched" to
environmental engineering, which really didn't amount to much of a
switch except probably dropping a compressible flow class for organic
chemistry.  When I went for my Master's, I may not have known as much
as some of my civil engineer classmates about road grading and
excavation shoring, but at least I had a basic concept of things like
wiring design and control logic, which they didn't have.
Good Luck!
Peter Temesvary, P.E.
Santa Monica, CA
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Subject: Re: Young's Modulus vs. Temperature
From: "Chris Rogers"
Date: Thu, 19 Sep 1996 20:22:11 GMT
Ken Irving  wrote in article
<9127cc$9161c.1e3@PolarNet>...
> In article <51onsq$juu@newton.cc.rl.ac.uk>, R.Paynter@rl.ac.uk says...
> >
> >Does anyone know relationships between Young's Modulus and Temperature
> >for typical "Engineering Materials", eg Steel, G.R.P.  I'm sure the
> >general effect is: "As temperature increases stiffness reduces" but
> >can anyone quantify it. I'm not looking for extremes, of stress
> >or temperature.
> 
> No, but the thought occurs that you could use such an effect to have a 
> structure resist resonating: a forcing function causes some vibration, 
> which heats the material, changing the modulus and shifting the resonant 
> frequency, reducing the vibration... 
> 
> 
Dream on, dream on!!  The change in Young's modulus is insignificant until
well over 100 degrees Centigrade, hence your not having to consider it for
normal design.  In addition, the frequencies would have to be so high that
only a few very special structures would be able to benefit from such a
process, and they will have other more important design aspects.
-- 
==+==+==+==+==+==+=[ http:\\www.cprsys1.demon.co.uk ]+==+==+==+==+==+==+==
Chris Rogers - Technical Director
CR Engineering Analysis & Computing         Engineering Solution Providers
cr-ea@cprsys1.demon.co.uk                           Commited To Excellence
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Subject: Re: MAKE MONEY NOW
From: "Tomislav Vazdar"
Date: 19 Sep 1996 23:09:31 GMT
Please DO NOT post such bullshit on the Usenet. There's no easy money.
-- 
TV
Tomislav in Cyberspace: http://www.open.hr/~tvazdar
E-mail: tvazdar@open.hr
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Subject: Re: aluminum on steel linear bearings?
From: peattier@aol.com (PEATTIE R)
Date: 19 Sep 1996 20:36:07 -0400
If you hard anodize the Aluminum it might work, otherwise it would be a
disaster
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Subject: Re: Tecplot, etc.
From: ssingh1@xws379.sc.intel.com (Surinder Singh)
Date: 19 Sep 1996 22:05:42 GMT
In article <323EFF92.41C6@flow.mit.edu>, Joe Curran  writes:
|> Does anyone out there know of a good site for information about 
|> linking Tecplot to Fortran 77 programs, or how to create binary 
Hey what is Tecplot ?
Is it as good as idl ? 
|> data files directly by F77 to be read real-time into Tecplot during
|> a run?
|> If anyone has any personal information/experience, that would be 
|> appreciated as well.
|> Thank you.
|> 
|> Joe Curran
|> curran@flow.mit.edu
|> Vortical Flow Research Lab
|> Massachusetts Institute of Technology
|> (617) 252-1635
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Subject: STEAM-LIST, A Mailing List About Industrial Steam
From: miles@mail.utexas.edu (Miles Abernathy)
Date: Thu, 19 Sep 1996 21:03:42 -0500
The STEAM-LIST is a free e-mail mailing list intended for discussion of
steam generators, piping, boilers, boiler feed pumps, water treatment,
corrosion and scaling, valves, PRV's, traps, turbines, flow metering,
heating coils, condensate pumps, district heating, system modeling, etc.
Practical discussions, rather than theoretical or academic ones, are the
intent of this list.
The list has a membership of about 250, spread all over the world.
To subscribe to the list, send the request
        subscribe STEAM-LIST YourFirstName YourLastName
in the body of a mail message to
        listproc@mcfeeley.cc.utexas.edu
Railroad steam locomotives are not included in this list.
-- 
Miles Abernathy, miles@mail.utexas.edu, http://klingon.util.utexas.edu/
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Subject: Re: FEA - inexpensive software packages?
From: Jeff Wright
Date: Thu, 19 Sep 1996 21:07:37 -0600
Morten Falk wrote:
> 
> Eric559810 wrote:
> >
> > Does anyone know of or use an inexpensive (<$3000) FEA software package?
> > If you sell such a package, please e-mail me directly with more
> > information.
> >
> > -Eric
> Hi Eric
> 
> Look out ALGOR http://www.algor.com . They have an excelent low-price
> and high quality FEA-software.
> 
> Morten Falk
I don't agree.  I was so disapointed in thier product that I 
asked for my money back.  If you've never used any other package
it may be ok.
-- 
*************************************************************
Jeff Wright, P.E.                       jwright@world-net.net
Staff Engineer                      	Ph: 210.980.4332
Progressive Engineering Services        Fx: 210.980.4332
     "A Mechanical Engineering Consulting Company"
*************************************************************
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Subject: Re: Pipe Flow Software
From: Greg Jackson
Date: 20 Sep 1996 03:03:05 GMT
"David C. Price"  wrote:
>I am looking for a software package to calculate pressure drops
>and flow in multi-loop pipe circuits.
>
>Any pointer for commercial or shareware packages would be appreciated.
>
>Thanks
>David Price
>dcprice@dsmea.com
You will find several programs of this nature in the MechEng 
Archive of engineering software.  The general site is available 
at http://www.mecheng.asme.org while the archive is at 
ftp://ftp.mecheng.asme.org/pub.  The specific area you are 
looking for is 
   ftp://mecheng.asme.org/pub/fluid  
If you look for a text file titles !FILES you will find a short 
description of each of the files in that catagory.
G. Jackson
MechEng Archive
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Subject: Re: Assistance needed with o-ring problem
From: tsiporak@actcom.co.il (Israel Kehaty)
Date: Thu, 19 Sep 1996 22:26:19 GMT
In article <51l66h$8sa@uhura.phoenix.net>, jflester@phoenix.net says...
>
>I have an o-ring problem.  I have a radially compressed
>o-ring with a 5/16" cross section diameter.  The joint
>is a static one sealing primarily air.  The operating temp
>is approximately 300 degF and operating pressure is
>90 psig.  The o-ring is also exposed to water and small
>concentrations of anhydrous ammonia.
>
>Any ideas on material...?  What would the recommended
>gland dimensions be?
>
>Any assistance would be appreciated.
>
>Sincerely,
>
>Jeff Lester
>
The rubber material that perform satisfactory with all three medias is
Ethylene Propylene. The gland depth for static applications is 
0.83 * cross section diameter = 0.259" or 6.58 mm. in your case. The gland 
width is taken such the Gland width * Gland depth = the area of the O-ring 
cross section.
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Subject: Re: Pipe Flow Software
From: DPAS@msn.com (DENNIS ADAMS)
Date: 20 Sep 96 06:02:38 -0700
Stoner Associates, Houston Texas
Scientific Software Intercomp, Houston Texas
Expensive but does everything.
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Subject: Re: Young's Modulus vs. Temperature
From: Jim Papadopoulos
Date: Fri, 20 Sep 96 01:18:23 -0500
Robert Paynter  writes:
>Does anyone know relationships between Young's Modulus and Temperature
>for typical "Engineering Materials", eg Steel, G.R.P.  I'm sure the
>general effect is: "As temperature increases stiffness reduces" but
>can anyone quantify it. I'm not looking for extremes, of stress
>or temperature.
>
I suspect it's far more complicated than most
people imagine.
I'm looking at a paper called"the dimensional behaviour of materials"
by L. M. Schetky, and he shows (for example) a complicated
curve for modulus change (of order 5%) for Aluminum,
as a function of working stress.
His table 5 gives "modulus change" over the -50F -- +150F
range, all the (fairly exotic) engineering metals
increased by about 3% to 6%.
I do remember a book on precision mechanisms, where the
author averred that change ov modulus was
at least as important as thermal expansion, for
dimensional stability.
Doesn't "elinvar" show an "S"-shaped
curve of modulus with temp??
Cheers
Jim
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Subject: Re: ANNOUNCE: Video Camera On a Chip to be produced in USA
From: sam@stdavids.picker.com (Sam Goldwasser)
Date: 19 Sep 1996 16:55:53 GMT
In article <51p9n0$h4j@vixc.voyager.net> aaedonnelly@voyager.net writes:
>   camcorders, and weapons are all niche markets!  Don't forget that the only 
>   difference between B&W; and color is just a color mask and interpolation 
>   logic.  Therefore, a $20 color camera is not a unreasonable requirement.  
Not quite abut still a reasonable argument.
--- sam
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Subject: Re: Need heat transfer material
From: Mark Thornton
Date: Fri, 20 Sep 1996 09:32:37 +0100
Wayne S. Hill wrote:
 > On 17 Sep 1996 16:18:28 -0400, Jon Wilder (jonwilder@aol.com) said...
> >
> >Searching for a thermally conductive medium to place between a curved
> >aluminum heater and a round stainless steel boiler/chamber.  The two are
> >fastened tightly with four stainless steel bands. Hoping to find something
> >with very high thermal conductivity.  Would be open to paste, or powder,
> >or sheet forms if anyone knows of something that might be suitable.   This
> >substance must survive up to at least 300 C
The Cambridge Materials Selector (see http://www.granta.co.uk 
for more details) suggests that you use either 
Beryllia or Copper-Zirconium alloys, in sheet form.  Apart from 
diamond (ruled out for obvious reasons), these look the 2 best 
solid materials for your application.  
The Copper alloys are cheaper, but look slightly borderline on the 
300 C service temp. criterion.  Beryllia is more expensive, but will 
pass that criterion with ease.
Hope this helps,
Mark Thornton
-- 
Mark Thornton				Tel: +44 1223 332760
Cambridge University Eng. Dept.		Fax: +44 1223 332662
Trumpington Street			E-mail: mht11@eng.cam.ac.uk
CAMBRIDGE CB2 1PZ, UK			
http://www2.eng.cam.ac.uk/~mht11/
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Subject: Re: Cost indexes
From: Robert Davis
Date: Fri, 20 Sep 1996 00:18:18 -0700
Richard Mateles wrote:
> 
> David Gionet wrote:
> 
> > Also, I was wondering where I could get a flowsheet for a typical
> > brewery to better understand the industrial beer making process.
> >
> > Thanks
> 
> Flow sheets appear in a number of books, e.g. "Industrial Microbiology"
> by C.G. Dunn; "Industrial Microbiology," A.H. Rose, and others.  These
> books are ca. 30 years old, but the general processes haven't changed,
> and some more up-to-date books lack process flow sheets.
> 
> Rich Mateles
> --
> Candida Corporation
> Suite A-1706
> 175 W. Jackson Blvd.
> Chicago, IL. 60604
> U.S.A.
Check out the September issue of Chemical Engineering mag, page 45 there
it is.
Later,
Rob
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Subject: boiler feed pumps - ph & oxygen levels on material selection
From: andrew@gilkes.u-net.com (Andrew Wood)
Date: Fri, 20 Sep 96 19:19:58 GMT
> Has anybody any information, research papers etc. on boiler feed pump selection and materials
> in general, and in particular relative to Ph and oxygen levels of the pumped liquid?
> 
> ----
> George Aggidis
> Andrew Wood
> Gilbert Gilkes & Gordon Ltd
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Subject: Re: Tecplot, etc.
From: Polyhedron Software
Date: Fri, 20 Sep 1996 09:28:15 +0100
In article <51sg3m$jf6@itnews.sc.intel.com>, Surinder Singh
 writes
>In article <323EFF92.41C6@flow.mit.edu>, Joe Curran  
>writes:
>|> Does anyone out there know of a good site for information about 
>|> linking Tecplot to Fortran 77 programs, or how to create binary 
>
>Hey what is Tecplot ?
>Is it as good as idl ? 
>
>
>
>
>|> data files directly by F77 to be read real-time into Tecplot during
>|> a run?
>|> If anyone has any personal information/experience, that would be 
>|> appreciated as well.
>|> Thank you.
>|> 
>|> Joe Curran
>|> curran@flow.mit.edu
>|> Vortical Flow Research Lab
>|> Massachusetts Institute of Technology
>|> (617) 252-1635
Tecplot is a stand alone data visualization package available from
Polyhedron Software Ltd (Europe) or directly from Amtec Inc 1-800 676
7568 or 206 827 3304 (USA and Canada).
It is particularly good at modeling curvilinear grids and is ideal for
finite element and fluid dynamics problems, as well as graphing and
charting.  Version 7 for UNIX has just been released and the Windows
version is due for release soon. 
Sue Taylor
-- 
Sales Dept.                  Sales@polyhdrn.demon.co.uk
Polyhedron Software Ltd.        
Programs for Programmers - QA, Compilers, Graphics
************ Visit our Web site on http://www.polyhedron.co.uk/ ************
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Subject: Re: Human Powered Vehicles - looking for a news group
From: Doug Milliken
Date: Mon, 16 Sep 1996 04:43:13 GMT
Hi,
On 15 Sep 1996, cruberg wrote:
> I'm interested in human powered vehicles (planes, bikes, cars, etc). 
> Are there any active groups on this topic...thanks in advance..Chris.
Check out the International Human Powered Vehicle Assn. web site:
	http://www.ihpva.com ,  or some such address (search on the web
		if my memory is wrong)
This should tell you how to join the hpv mail-list which I believe is
carried as part of the "cyclery.com" group.  
The signal-to-noise ratio may be poor, since we (I'm an ex-IHPVA officer)
are undergoing management problems at this time...  which is why I'm not
signed-on to the newsgroup. 
You can also check on rec.bicycles.tech which has some good contributors.
-- Doug
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Subject: Baby's skull - modelling mechanical properties
From: Paul Kurowski
Date: Thu, 19 Sep 1996 17:53:07 -0400
I'm trying to model the mechanical behavior of 
fetus’s skull during it’s passage through the birth 
canal. My tool is Finite Element Analysis and my 
objective is to investigate skull stresses, 
deformations etc. as factors possibly contributing 
to birth defects. I plan on running a contact 
stress problem and assume, to begin with, small 
deflections.
I am having difficulties finding mechanical 
properties of newborn’s skull: bone(cartilage ?) 
material properties, skull thickness etc. Could 
somebody direct me to the source of information or 
share their experience with a similar problem ?
Any help and/or comments would be mostly 
appreciated. In return I could share with you my 
results.
Paul M. Kurowski
please e-mail to:
kurowska@julian.uwo.ca
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Subject: Re: Young's Modulus vs. Temperature
From: arosen@freenet.columbus.oh.us (Alan Rosenfield)
Date: 20 Sep 1996 09:21:11 -0400
:  
: I do remember a book on precision mechanisms, where the
: author averred that change ov modulus was
: at least as important as thermal expansion, for
: dimensional stability.
:  
I think that this book would be 'Dimensional Stability in Materials' by R.
E. Maringer and C. W. Marschall. It is about 20 years old.
-- 
Al Rosenfield
1650 Ridgway Pl., Columbus OH 43212 USA
phone: 614/486-8892; fax: 614/481-8038
e-mail 
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Subject: Re: PE Liability
From: Eric Mieczkowski
Date: Fri, 20 Sep 1996 09:16:16 -0700
pvincent@execpc.com wrote:
>
> < SNIP >
> 
> You are held personally responsible for any errors that occurs in your work
> or that done under your supervision, _if you sign the plans as the registered
> engineer in charge of the work_.
> 
Does this hold true for an engineer working withing a corporation, or just an 
independant consultant?  In other words, if I sign of on a design at my 
employer and that design fails catastrophically and injures someone, who will be named 
in the lawsuit my employer, myself, or both?  And would that be any different if I did 
not hold a PE?
>
> < SNIP >
> 
> What this boils down to is:  If you want to do consulting work, get it.
> Consultants tend to work in fields which require PE's.  If not, in my
> experience, it's not a requirement.  In my case, I don't need it, don't use it,
> but I am proud to have "P.E." after my signiture on the letters I send.
> It may (and I mean _may_) be worth a buck or two if you are job seeking.
>
> < SNIP >
Yup.  I'm pursuing registration for the same reasons.  I do not have a perticular 
"NEED" for it right now.  Perhaps some day I will get involved in consulting, but not 
for at leas several years.  I just want the satisfaction of the achievement and 
recognition.
Thanks for the reply,
Eric Mieczkowski
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Subject: Re: Tungsten-Rhenium Alloys - data wanted
From: Thomas.P.Herbell@lerc.nasa.gov (Thomas P Herbell)
Date: 20 Sep 1996 13:46:21 GMT
You may reach Dr. Boris Bryskin at
>
>Rhenium Alloys, Inc.
>P.O. BOX 245
>Elyria, Ohio  44036-0245
>USA
>
>Office: (216) 365-7388
>Faxx:   (216) 366-9831
>
>
>
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Subject: Re: high pressure coolant retrofit
From: klwasson@aol.com (Klwasson)
Date: 20 Sep 1996 09:35:19 -0400
>Does anyone have any info on retrofitting high pressure coolant systems
>on Mazak HMC's?  I'd like to get to approx 1000 - 1500 psi on a H630
>machining center.  Any vendor info, personal experience or suggestions
>would be greatly appreciated.
>TIA
>-- 
>Joe Smolen - Tooling
>Engineer                                                                 
>Plesh Industries, Inc.
>One River Rock Drive
>Buffalo, NY 14207
>(716)873-4916 voice
>(716)876-8370 fax
That's a good question.  It is hard to find good pumps that can handle
1,000-1500 psi of coolant at rates over 10 gpm.  Oil is easy because it
has a lubricity, but coolant doesn't.  Piston pumps (sold to car washes)
are inexpensive and can handle the requirement, but they are
overwhelmingly loud.  They also have substantial pressure pulsations.
Gear pumps wear out.  The lubricity problem.
We recently tried a screw pump sold by Knoll, a German company.  It was
designed for oil, but they said coolant is no problem.  Uh uh.  It
vibrated itself to death within an hour.  They said it must have been our
fault (!) and refuse to give our money back.  They sent us a smaller
version and although it is working it is also loud.  There are just
sliding contact bushings in there, so it is no wonder.
If you find a good high-pressure coolant pump that is inexpensive and
quiet please give me an email (klwasson@aol.com), I would appreciate it. 
I'll do the same.
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Subject: Re: Which engineers are more in demand?
From: rizzo@hogpb.ho.att.com (-A.RIZZO)
Date: 20 Sep 1996 13:45:35 GMT
In article <51rg03$j36@nntp.netside.com>,
Jay Puckhaber  wrote:
:rizzo@hogpb.ho.att.com (-A.RIZZO) wrote:
:
:>Somebody asked:
:>>> Of mechanical, electrical, and aerospace, which engineer is more in
:>>> demand? And which would you do if you were interested in all 3?  (or
:>>> all 8 for that matter) Thank-you kindly.
:.....
:< Were I bent  on getting a degree in engineering today, and were
:
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Subject: Re: engineering schools
From: Cedric Savineau
Date: 20 Sep 1996 12:28:33 GMT
Vernon Kong Yeut Ho  wrote:
>
>         What are the top 10 engineering schools in America?
> 
> 
Check out the special issues of Newsweek or USNews or any of those
news magazines. Every september or so they come out with a ranking
of all the US universities, classified by discipline.
Cedric Savineau
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Subject: Re: Pipe Flow Software
From: cbeer@netcom.com (Cindy Beer)
Date: Fri, 20 Sep 1996 14:17:44 GMT
You may want to check out our web page for SINDA/FLUINT and SINAPS, ouer 
thermal/fluid design and analysis software.  There is a demo version 
available.  The address
http://www.webcom.com/crtech
Or send me an e-mail, and I will be happy to send information.
Cindy Beer
-- 
         _______
   _____   \|   \\
 //    \|  ||    ||      Cullimore and Ring Technologies, Inc.
||      |  ||___//               49 Dawn Heath Circle
||         ||  \\            Littleton Colorado 80127-4303
||         ||   \\                  (303) 971-0292
 \\        ||    \\               cbeer@netcom.com                       >
   ========================================================================== >
                       Thermal/Fluid System Design and Analysis          >
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Subject: Looking for UK Job Shops
From: "John F. Smith"
Date: 20 Sep 1996 17:16:00 GMT
I am looking for Job Shops in the UK that does casting and brazing
specifically with Albemet composite material.  Any help would be
appreciated.
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Subject: Re: Properties of polyurethane sought
From: rongraham1@aol.com (RonGraham1)
Date: 20 Sep 1996 12:46:15 -0400
Thanks to those who responded.  I located the information
I originally sought.  The company offering (among other
things) a brochure discussing the physical and material
properties of polyurethane is
Gallagher Corporation
3906 Morrison Drive
Gurnee, IL   60031  USA
800-524-8597
They also give you a little key-ring with color-coded durometers.
:-) :-) :-)
Dr. Ron Graham
Project Engineer for Robotics, GreyPilgrim LLC, Philadelphia
EMMA Robotic Manipulator now online at http://www.greypilgrim.com
"Gentlemen, we just put Sir Isaac Newton in the driver's seat."
 -- Tom Hanks, as astronaut Jim Lovell, "Apollo 13"
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Subject: post doc in engineering
From: hines@drea.dnd.ca (Paul Hines)
Date: Fri, 20 Sep 96 15:16:46 GMT
Defence Research Establishment Atlantic (DREA) is looking for a
post-doctoral fellow in electrical or mechanical engineering for a 1 year
fellowship position (extendible to 2 years), at the laboratory.  The
successful candidate must be a Canadian citizen, must be fluent in English,
and must have completed a doctoral thesis within the last 5 years.  The
position offers the opportunity to work with a team of 5-10 scientists and
technologists to design and construct a novel research sonar for use in
open-ocean experiments.  The successful applicant must bring hands-on
engineering-design skills to the position.
DREA is located in Halifax-Dartmouth, Nova Scotia, Canada.  For more
information on DREA, see our WWW page at: 
http://www.drea.dnd.ca/HTMLpages/english_table.html
The fellowship has an annual value of approximately $35,000 CA plus a travel
allowance for fellow, spouse, and family.  Prospective applicants are
encouraged to contact Dr. Paul C. Hines for more information.
Dr. Paul C. Hines
Leader/Airborne Sensors Group                Phone:    (902) 426-3100 ext. 321
DREA, P.O. Box 1012                          Fax:      (902) 426-9654
Dartmouth, NS, Canada, B2Y 3Z7               Internet:  hines@drea.dnd.ca
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Subject: sterling engine???
From: gekeays@acs5.acs.ucalgary.ca (Gloria Edith Keays)
Date: 20 Sep 1996 18:24:38 GMT
I was wondering if anyone out there is familiar with the last
research into Sterling engines.  What were the problems with
manufacturing them?  Is there a relatively simple book still in
publication available concerning sterling engines?
I know they used to be used as water pumps many, many years ago,
and I know that without decent cooling, the differential started
to get to the point that the engines no longer ran effectively,
and that the seals around the shafts started to wear out, thus
reducing efficiency.  
How long does this take on relatively affordable seals, and what
approximate times of use would be involved between overhauls?
Thanks to anybody who can answer these questions.
Rod (on his wife's account...)
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Subject: REQ.: high pressure pipes - methods to study the effects of a break
From: rollet@worldnet.fr (Patrick Rollet)
Date: Fri, 20 Sep 1996 20:35:01 GMT
Does anyone know of a book which could be helpful to study the effects
of a break on a high pressure pipe ?  (parameters, stresses caused
after a break by "whip" effect, transient overpressure if the pipe is
linked to a pressure vessel through a non return valve ...).
As far as I know, the ASME code does not supply particular rules, but
I might be wrong.
Thanks for any answer.
Patrick Rollet
rollet@worldnet.fr 
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Subject: Theoretical Mechanics: Curriculum Discussions (Re-post)
From: seaotter6@aol.com (Sea otter6)
Date: 20 Sep 1996 17:28:03 -0400
The following is relayed from
Professor Alexei Kostarev:
>Professor of Theoretical Mechanics at St.Petersburg
>Technical University would like to make e-mail contact  with
>colleagues in other countries to discuss the curriculum,
>approaches and more.
>
>Please write by e-mail to ALEXEI KOSTAREV: alexei@hofak.hop.stu.neva.ru
If you have colleagues who may not see this but might be interested,
kindly
forward this message to them.
Because of unresloved technical probems, e-mail addressed to Profesor
Kostarev
is occasionally lost enroute.  For this reason, when making an initial
contact,
kindly send a carbon copy to me, so that I can make sure he got your
message.  
Many thanks.
Larry in Berkeley
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Subject: Re: Young's Modulus vs. Temperature
From: rjh2@pl264d.cc.Lehigh.EDU (RONALD J. HARTRANFT)
Date: 19 Sep 1996 21:26:47 GMT
On 18 Sep 1996 11:54:02 GMT in sci.engr.mech,
Robert Paynter (R.Paynter@rl.ac.uk) wrote:
> Does anyone know relationships between Young's Modulus and Temperature
> for typical "Engineering Materials", eg Steel, G.R.P.  I'm sure the
> general effect is: "As temperature increases stiffness reduces" but
> can anyone quantify it. I'm not looking for extremes, of stress
> or temperature.
What usually happens in steels is that the modulus of elasticity
remains nearly constant but that yield stress decreases as temperature
increases.  For details, see:
American Society for Metals, "Metals Handbook", 9th ed., Vol. 1,
"Properties and Selection / Irons and Steel", 1978.
H. E. Boyer, "Atlas of Stress-Strain Curves", ASM International, 1987.
--
Prof. Ronald J. Hartranft          http://www.Lehigh.edu
Dept. of Mech. Engr. & Mechanics         /~rjh2/rjh2.html
Lehigh University                  Phone: 610-758-4109
19 Memorial Drive West             Email: rjh2@Lehigh.edu
Bethlehem, Penn. 18015-3085
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Subject: Re: PE Liability
From: VENABLE@cemr.wvu.edu (Wallace Venable)
Date: Wed, 18 Sep 1996 18:30:29 GMT
>Please help me put this one to bed.
	For that, you need to go to bed with a lawyer.
	I'm not a lawyer, but....
>Does professional engineer licensing have any bearing on legal 
>liability?  
	Probably not much, you are always liable for injuries to others.
>In other words, does holding a PE license increase, 
>decrease, or maintain my current level of liability for a product 
>design?
	In a product defect suit, the plaintiff (injured one) usually goes 
primarily for "the big pocket."  The designer usually has a small collection 
of assets, the manufacturer a large one.  The manufacturer is (usually) 
responsible for design, manufacturing, labeling, instruction manuals, 
distribution, and oftern some maintenance.  The designer, only for the 
design.
	If you design as the employee or agent of the manufacturer, you are 
a secondary target, licensed or not.
	To design as a contractor, you (probably) are required by law to be 
registered since you are providing engineering services.  A consultant 
usually has some protection as a "small pocket."
>I'd really like to understand this better before I make a decision on 
>whether or not to complete the licensing process.  I'm pursuing a 
>license purely for the personal satisfaction of having it.  I'm an ME 
>in a field that does not require licensing.  I'd like to know what I'm 
>getting myself into.
	Who knows?
	Unfortuneately today every license has costs and risks associated 
with it.  A commercial driver needs drug tests, a PE must complete, log, and 
report continuing education, etc.  In addition, being seen as a professional 
may lead a jury to assign greater blame if something is screwed up.
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Subject: Re: ANNOUNCE: Video Camera On a Chip to be produced in USA
From: guz2@fm550g.cc.lehigh.edu (GUANGHUA ZHANG)
Date: 19 Sep 1996 17:53:56 GMT
Richard Steven Walz (rstevew@armory.com) wrote:
: In article <51hqaf$prg@dfw-ixnews8.ix.netcom.com>,
: LEONARD MARSHALL  wrote:
: >VIDEO CAMERA ON A CHIP made in USA
: >
: >The CMOS sensor has 72,000 pixels and has a  EIA  B&W; composite video
: >ouput. Operates on only 5VDC @20Ma.vs. 120Ma for the standard CCD
: >sensor.
: >
: >The complete camera on a chip  has all circuitry needed to see a 225 TV
: >line B&W; picture on a standard video monitor.
: >
: >Complete camera on a chip will sell for under $20.00 in 10,000 pc.
: >quantities. A complete camera with lens & miniature cabinet will sell
: >for under 49.00 @ 500 pcs.
: >
: >For more information contact: Leonard Rogers or Nathan Mordukhay
: >Optical Systems Div. Marshall Electronics.
: >Lmarsgo@ix.netcom.com
: >Tel:1-800-800-6608
: -----------------------------------
: They'll have to do a BIT better. I have lately seen a flood of used or
: overstocked NTSC B&W; surveillance cameras out there for $50 each! For
: something small, that's cute, but it'll have to come down to $20 to
: actually dent the market, except for people building little "bug"
: robots and blimps. That's a limited nich market. They will sell at $20
: or $25, but it won't make them wealthy instantly! They'll have to work
: some years to get the price down and profit up to do that! Then
: they'll just make three of them into cheaper camcorders is all with
: color filters. America DOES want cheaper camcorders!! If somebody can
: hit the camcorder market at half the going price and small, they could
: clean house. But that's the only way to sell those, except for tiny
: surveillance, and that demand, despite news of terrible crime levels
: is going down as crime is actually diminishing as the population ages.
: -Steve Walz   rstevew@armory.com    http://www.armory.com/~rstevew/
: --
The above camera is on the expensive side.
I know a company sells CMOS cameras at a much cheaper price.
Camera 1:a complete system for under $40 in large quantities.
The PCB, including chip and all other components, measures 22mm diameter. 
The device features automatic exposure control over 5,000:1, enabling the 
use of a fixed-aperture lens. Automatic gain control provides up to +10dB 
gain boost at low light levels. 
. Resolution: 369*287; 
. Pixel size: 10.8*10.8um2; 
. Sensing area: 3.99*3.10mm2; 
. Min illumination: 0.5 Lux; 
. Video output: CCIR standard  
. Lens:1/3 inch; 
. Supply voltage: 7-12V DC; 
. Power: < 200mW; 
Camera 2: a complete system for under $70 in large quantities.
This has all the features mentioned above.
The PCB, including chip and all other components, measures 30 mm diameter. 
. Resolution: 768*574 ( also selectable for 640*480 and 512*512) 
. Pixel size: 10.8*10.8um2; 
. Sensing area: 8.29*6.20mm2; 
. Min illumination: 0.2 Lux; 
. Video output: CCIR and EIA format
. Lens:2/3 inch; 
. Supply voltage: 7-12V DC; 
. Power: < 300mW; 
. Non-interlace selection for image acquisition; 
Gary Zhang
EECS Department         Tel: (610) 758 4064 
Lehigh University,      Fax: (610) 758 6279
Bethlehem, PA 18015     Email: gzhang@vast.eecs.lehigh.edu
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Subject: A simple question about bending dies
From: felice@pioneer.net (Felice Luftschein & Nicholas Carter)
Date: Fri, 20 Sep 1996 22:07:18 GMT
I am designing a die to put a 1/2" ID u-bend at unspecified intervals
along a 2" wide 3/16" thick Hot Rolled steel strip. This means there are
three separate bends, one 1/2" ID u-bend, then two 90 degree bends with
small radius. This is to be a simple die, used in an 20 ton or (less) hydraulic
press. so that the strip can be fed in one side, the bend lined up with scribe 
marks, and the bend made.
I have no problem with the bending radius, or elongation, but cannot
for the life of me find out how to calculate the force required for such
a bend. I've looked in two die books, but they only give forces for shearing
or blanking dies, not for bending dies. 
I am not an engineer, if you haven't guessed yet.
Can anyone descibe how to figure this out, or failing that,
recommend some books which will?
Thank you
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Subject: Re: FEA: Modelling Bolt Holes
From: osman@stargate.cinternet.net (osman buyukisik)
Date: 20 Sep 1996 21:47:20 GMT
In article , Christopher Wright wrote:
>In article <3235E749.1242@julian.uwo.ca>, Paul Kurowski
> wrote:
>
>> With mesh refinemnt, your displacements 
>>will converge to infinity. 
>
>I'll quibble with this. The stress under a point load will increase
>without limit as the mesh is refined, but the displacements won't. And I
>think the St. Venant effect guarantees a converged stress solution within
>a couple of element widths of the point load, anyway.
>
BOTH stress and deflection increase without limit (elastic analysis). 
Stress is prop to 1/r, deflection to log(r). You may not notice the
deflection increase as it will be very slow. The following numbers are from an 
experiment 5x2x1 block supported on three sides, force at the middle top. 30e6,.3 
are material props. Force=100 lbf.
Element size        deflection        stress
1		0.56e-5			115
0.5		0.67e-5			200
0.25		0.83e-5			399
0.125		0.97e-5			816
0.0625		1.12e-5			1691
If you plot these (using gnuplot?), you'll see the above relationship holds.
It is hard to say by just looking at deflections that they are growing without bound.
But THEY ARE!
Osman
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Subject: Re: Baby's skull - modelling mechanical properties
From: rizzo@hogpb.ho.att.com (-A.RIZZO)
Date: 21 Sep 1996 01:12:04 GMT
In article <3241C0C3.5E82@julian.uwo.ca>,
Paul Kurowski   wrote:
>I'm trying to model the mechanical behavior of 
>fetus' skull during it's passage through the birth 
>canal.  My tool is Finite Element Analysis and my 
>objective is to investigate skull stresses, 
>deformations etc. as factors possibly contributing 
>to birth defects. I plan on running a contact 
>stress problem and assume, to begin with, small 
>deflections.
I watched, as my two sons were born.  I say this with
conviction.  There is nothing small about the deflection
of anything associated with a birth.  Nor were small
strains involved.
Tony Rizzo
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